Testing the outer packaging is a fundamental process of quality analysis. The condition of the packaging and the label is analyzed and evaluated. Among other things, the ESD (Electrostatic Discharge) note, the MSL (Moisture Sensitivity Level) note, the original label, etc.

The packaging guidelines must comply with the JEDEC standards. The test protocol contains conclusions that indicate the authenticity, handling and origin of the goods. Important indicators are obtained in connection with further tests.

Visual parts inspection is a fundamental procedure in the quality assurance process that ensures the reliability of electronic components. During this detailed inspection, various parameters such as mechanics, component group, surface finish, serial numbers, external damage, etc. are measured and recorded. The main objective is to determine the condition of the components in more detail and their quality spectrum. High-precision instruments that meet the latest technical standards are used for exact evaluation and analysis.

The component packaging is provided with a label, which is attached either to the outer packaging or to the inner packaging, e.g. a roll or a tray. It is important that the label is carefully checked for authenticity.

It should be noted that each manufacturer has its own label format. General information such as part number, quantity, batch code, production period, manufacturer's name, manufacturer's logo, moisture sensitivity, country of origin, barcode, 2D/3D dot matrix code and lead-free information can be taken from the label.
The information obtained from a careful inspection provides important indications as to whether components are genuine or counterfeit or whether the quality and properties meet the actual requirements based on intensive tests carried out by us.

The read-out and correctly interpreted data plays an important role when it comes to the traceability of goods and their illegal marketing. We work with our partners worldwide to provide support in this area, for example to prevent high-performance components from being exported to sanctioned regions.

The analysis of the mechanical dimensions of the housing is part of the component test. The length, width and thickness of the enclosure, the number of ports, the width of the ports and the thickness of the ports are some of the parameters that need to be checked in order to perform further tests. The manufacturer's data sheet and the enclosure specification (JEDEC standards std-030) are an additional aid for a detailed assessment of the enclosure, the condition of the connections and later also the solderability.

Shadow effect mode is a feature of state-of-the-art, high-performance optical microscopes that are equipped with high-resolution lenses and high-performance luminaries for observing and analyzing component surfaces.

The high resolution enables the observation of fine contours and uneven surfaces or of strains, defects in the sub-micrometer range and height profiles. This even at the lowest magnifications, which would be almost impossible to analyze with optical instruments.

The Optical Shadow Effect Mode was developed by combining a 4K CMOS image sensor with a new type of lighting technology. It is ideal for detecting counterfeit components as it can capture more details than conventional instruments. Detecting counterfeit or low-quality products and removing them from the market to prevent damage to our customers and partners is one of our main objectives with this forensic test.

Remarking involves counterfeiters removing the original markings from the component and re-marking it with counterfeit information. For this purpose, grinding methods are used that leave grinding marks to remove the original marking such as part number, date code, country of origin, etc.

In re-surfacing, the original surface is altered by smoothing, shaping or cleaning a hard surface by spraying solid particles over the surface at high speed. During the counterfeiting process, components are reworked or falsely labeled to pass off inferior products as high quality. This method is even riskier than placing “fakes” on the market, as many customers do not notice any irregularities when the components are subjected to normal wear and tear, but massive damage can occur in extreme situations.

The optical tests that we carry out to record the surface quality can already provide important data that indicates inferior components or “fakes”. However, only a chemical test can provide absolute clarity as to whether a component has been tampered with. We carry out all tests to detect contamination and surface changes in accordance with the international SAE standards.

To ensure the quality and reliability of soldered connections on PCBs and components, solderability testing is crucial. Two commonly used methods for evaluating solderability are the “dip and look” test and the “wetting balance” test. These tests play a crucial role in assessing the effectiveness of solder joints and the overall soldering process.

In the “dip and look” method, components or printed circuit boards are briefly immersed in molten solder and then visually examined for the quality of the resulting solder points.

The “wetting balance” test, on the other hand, uses precise measurements to assess the wetting properties of solder, providing valuable information about the solderability of electronic components.

Taken together, both tests contribute to a comprehensive evaluation of soldering processes and ensure the reliability and functionality of electronic assemblies in various applications. To carry out the wetting equilibrium test, devices are used that correspond to the latest state of development on the basis of IEC, IPC-J-STD-002 , MIL-STD-883 Method 2003 - valid test guidelines.

X-ray fluorescence analysis (XRF) or X-ray fluorescence spectroscopy (XRF spectroscopy) is a method that has its origins in material analysis and is based on X-ray fluorescence. At its core, XRF is about the interaction between X-rays and the elemental composition of the analyzed components. It provides valuable information about the nature of a broad spectrum of elements in the materials being analyzed.

XRF, which causes no harm during examination, has become an indispensable tool for researchers, scientists and industry experts who need to precisely record, evaluate and quantify the composition of substances.

In our laboratory, we use equipment that corresponds to the latest state of development in order to achieve optimal results in compliance with generally applicable test guidelines.

Energy dispersive X-ray analysis (EDX) is an excellent and non-destructive characterization technique for analysing the internal structure of a component. The lead frame, the topographical image, the bond wires, the position of the chip within the component and the inner conductor paths of a printed circuit board can be efficiently and precisely recorded and analyzed.

This method helps to localize elements that are located at a specific point on the component. In addition, it is possible to visualize the adhesion of crystals without damaging them or to check the quality of solder joints in printed circuit boards.

Our state-of-the-art X-ray inspection system was developed for analyzing electronic components such as diodes, ICs and printed circuit boards in a laboratory environment. One of the biggest advantages of our system is the ability to capture and evaluate multiple components simultaneously with very high resolution.

In the case of components of dubious origin, an X-ray inspection can show whether there is a chip in the component at all, whether the manufacturer has complied with the prescribed bonding sequence and whether bond wire connections are faulty. All measurements are carried out in accordance with the generally applicable test guidelines.

Moisture can impair the functionality of electronic components. A very high moisture content in the mass of a component is a decisive factor for damage during the manufacturing process (so-called popcorn effect).

The basic concept of drying or moisture measurement of electronic components is to control and record the moisture sensitivity as well as to develop quality assurance and reliability tests for components.

In the humidity test, a drying cabinet is used to control the relative humidity for components with a high MSL level. The drying process for electronic components is carried out in accordance with J-STD-033, followed by data analysis.

The drying process or moisture test serves to remove moisture from the component and to ensure that it can be reused without damage during the soldering process.

A drying oven with excellent humidity control of 0.2% at 60°C is used to perform the test.